Glob Top Epoxy
Niche-Tech Glob Top Epoxy is a high purity liquid epoxy designed for use as a glob top for Chip On Board (COB) applications. Our product exhibits minimum slumping and its rheology is designed to provide controlled flow to encapsulate electronic devises as well as to penetrate through the wire leads.
Niche-Tech Glob Top Epoxy is easily dispensed,minimizes induced stress, provides improved temperature cycling performance and has excellent chemical resistance.
Niche-Tech Glob Top Epoxy is easily dispensed,minimizes induced stress, provides improved temperature cycling performance and has excellent chemical resistance.
Our formulations offer protection against moisture, chemicals and contaminants. Also, they provide mechanical support and electrically insulative properties which making Niche-Tech Glob Top Epoxy is an ideal encapsulation material for bare die and wire bonds in COB.
PRODUCT SPECIFICATIONS
| Product | Viscosity | Thixotropic index | Cure Schedules | Tg | CTE | Color after Cured |
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BE-09 BE-08 BE-16 BE-16VT BE-16VT2 |
26000 cps 52000 cps 49000 cps 49000 cps 52000 cps |
1.25 1.45 1.53 1.25 1.40 |
60-90 min @130℃ 60-90 min @130℃ 30-40 min @150℃ 30-40 min @150℃ 30 min @100℃ + 150 min @155℃ |
143 ℃ 145 ℃ 131 ℃ 146 ℃ 132 ℃ |
≦ 45 ppm/℃ ≦ 45 ppm/℃ ≦ 40 ppm/℃ ≦ 40 ppm/℃ ≦ 40 ppm/℃ |
Matte Black Matte Black Matte Black Gross Black Matte Black |
Note: Other specifications can be custom made upon request.
Selection Matrix
CTE Comparison
Curing Comparison@150ﾟC (DSC)
Thixotropic Property (AR Rheometer)
